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Baking Process for Semiconductor Glass Substrates
In the world of semiconductor manufacturing, the quality of glass substrates is crucial for ensuring process stability and optimal product performance. One of the essential steps in preparing these substrates is the baking process, which effectively removes impurities and moisture from their surfaces. Before diving into baking, substrates undergo thorough cleaning and inspection. This typically involves soaking in dilute nitric acid to eliminate metal impurities, followed by rinsing with deionized water. Organic solvents like acetone and isopropanol are then used for ultrasonic cleaning, ensuring any grease or fine particles are completely removed.

Enhancing Quality: The Crucial Role of Drying Ovens in BGA and PCB Manufacturing
In the electronics manufacturing industry, the baking process is crucial for product quality and reliability, particularly for core components like BGA (Ball Grid Array) and PCB (Printed Circuit Board).

The heating methods of a semiconductor oven
A semiconductor drying oven is a specialized piece of equipment used in the semiconductor production process, primarily for heating, drying, and curing semiconductor materials, chips, and packages. Its internal environment is highly clean, with precise temperature control to meet the strict requirements of semiconductor materials during processing. This equipment is widely used in the production of semiconductor chips, integrated circuits, optoelectronic devices, and more, for drying moisture-sensitive components, removing water and volatile impurities from materials, and curing coatings.

Which processes in traditional packaging use ovens?
In semiconductor and integrated circuit manufacturing, packaging is critical to ensuring stable and reliable chip operation. Ovens, specifically industrial drying ovens used in the packaging process, control temperature and time to heat packaging materials for curing, drying, and stress relief. This ensures that key steps in the packaging process are completed smoothly, guaranteeing the quality and reliability of the final product.

The working principle and application of clean oven
In contemporary industrial production and scientific research, the need for drying materials, products, and components has intensified. To address these demands, advanced drying technologies and equipment are crucial for achieving efficient and precise outcomes. Furthermore, strict control over the drying process is essential to ensure product quality and safety. Clean ovens serve as vital drying equipment, widely used in environments that require high cleanliness due to their unique design and effective performance. Their distinct operational principles and various configurations enable them to cater to the diverse needs of different industries.

Hot Air Circulation Oven Development Trend
The optimization of the hot air circulation oven mainly focuses on improving the uniform distribution of hot air and enhancing thermal efficiency.

Equipment Characteristics and Principle of UV Curing Furnace
A UV curing furnace is a device that uses ultraviolet (Ultra-VioletRay) light to cure a specific material.The working principle involves adding photoinitiators to the material that generate active free radicals or ionic groups under ultraviolet light, which in turn trigger polymerization and crosslinking reactions.

Baking Temperature of Plastic Mold After Molding
In the production of plastic products, the pre-processing step of baking plastic raw materials is crucial. The primary purpose of this process is to remove moisture from the materials, thereby ensuring the quality and performance of the final product.