Which processes in traditional packaging use ovens?

  In semiconductor and integrated circuit manufacturing, packaging is critical to ensuring stable and reliable chip operation. Ovens, specifically industrial drying ovens used in the packaging process, control temperature and time to heat packaging materials for curing, drying, and stress relief. This ensures that key steps in the packaging process are completed smoothly, guaranteeing the quality and reliability of the final product.

  Molded package curing is one of the most common processes using industrial drying ovens. In this process, the chip, metal leads, and frame are placed in a mold, and liquid epoxy resin is injected. The mold is then placed in the oven for heating, allowing the resin to cure at high temperatures, forming a hard, protective packaging layer. The industrial drying oven provides a uniform and stable heat source to ensure even curing throughout the layer, avoiding localized under-cured or over-cured areas. Additionally, industrial drying ovens precisely control temperature and time, ensuring optimal curing conditions for the resin and achieving the best packaging results. They can also regulate humidity and atmospheric conditions inside to meet the requirements of different packaging materials, ensuring the quality and reliability of the package.

  Before packaging, the chip and other components may need pretreatment steps like cleaning, drying, and preheating. These steps are usually performed under specific temperature and humidity conditions to ensure a smooth packaging process. An industrial drying oven is primarily used for cleaning and drying in pre-bake treatments, removing moisture and impurities from the chip surface through heating and ventilation to ensure good contact between the packaging layer and the chip. The oven can also heat the chip to a certain temperature, reducing thermal stress and deformation during packaging, thus improving packaging quality.

  After packaging, products may undergo post-treatment steps like removing air bubbles, improving interface performance, and reducing stress. Industrial drying ovens are used to remove bubbles by controlling temperature and time, which helps eliminate bubbles in the packaging layer, improving its density and reliability. Ovens also promote interface reactions between the packaging material and the chip, enhancing electrical and mechanical properties. Moreover, by controlling temperature and time, industrial drying ovens reduce thermal and mechanical stress during packaging, enhancing the product’s long-term stability.

  In traditional packaging processes, industrial drying ovens are widely used in molding, pre-bake treatments, and post-bake treatments. These ovens provide uniform, stable heat sources, precisely control temperature and time, and maintain certain humidity and atmospheric environments to ensure the quality and reliability of the packaging process. The application of ovens in packaging will continue to be optimized to meet higher performance and stricter quality requirements. Yihonxin Mechanical & Electrical will continue to develop and improve heat treatment equipment, providing suitable heat treatment solutions for industrial manufacturing enterprises.