Enhancing Quality: The Crucial Role of Drying Ovens in BGA and PCB Manufacturing

  In the electronics manufacturing industry, the baking process is crucial for product quality and reliability, particularly for core components like BGA (Ball Grid Array) and PCB (Printed Circuit Board). The primary aim of baking is to remove moisture from materials, enhancing product stability and ensuring that moisture-related issues do not arise during subsequent production and use.

  For BGA, baking time should be at least 180 seconds to ensure sufficient evaporation of internal moisture, with some specialized types requiring up to 300 seconds. The baking temperature should be set between 130°C and 160°C to effectively remove moisture without causing thermal damage to internal components. It’s essential to ensure even heating and allow natural cooling post-baking to avoid internal stress.

  Similarly, for PCBs, baking time correlates with storage duration. Newly manufactured PCBs typically require little to no baking within two months of production. However, as storage time increases, longer baking durations become necessary. For PCBs stored for 2 to 6 months, a baking duration of 2 hours is recommended; for those stored for 6 to 12 months, 4 hours is advised; and over 12 months, 6 hours or longer is suggested.

  The baking temperature for PCBs should generally be set at 120°C ± 5°C to remove moisture effectively while preventing thermal damage. Uniform heating is critical, as is allowing natural cooling before further processing. Properly setting baking time and temperature is vital for enhancing stability and reliability, and using a drying oven designed for this purpose can significantly optimize results.